Driven by surging demand for data centre AI accelerators, semiconductor designs are advancing rapidly through new architectures, larger formats, and faster I/O interfaces. 

In this webinar, Smiths Interconnect experts explore the critical challenges these innovations create for mass production testing, including the interconnect wall, memory wall, and thermal wall, and share practical strategies to help test teams stay ahead.

Key takeaways:

• Gain a clear understanding of AI chip testing trends for 2026 and beyond. 
• Discover proven testing solutions for ultra-large-scale packages, including BGA and LGA.
• Connect directly with Smiths Interconnect’s technical experts to discuss specific testing pain points.

Speakers:

Justin Bahaj - Product Line Manager at Smiths Interconnect, a Molex company
Justin Bahaj holds a Bachelor’s degree in Physics from Washington University in St. Louis, as well as a Master of Science in Physics and a Master of Engineering in Mechanical Engineering from Iowa State University. He joined Smiths Interconnect in 2017 as a Design Engineer in the Semiconductor Business Unit, and is passionate about collaborating with multinational teams to advance cutting-edge technologies for industry-leading customers.

Joshua Daniel – Product Line Manager at Smiths Interconnect, a Molex company
Joshua Daniel has nearly a decade of experience in the burn-in industry, with hands-on expertise spanning design, manufacturing, technical and commercial activities. His background also includes in-line manufacturing, automation, and the development of next-generation computing device test fixtures.