Skip to content

Backplane Twinax Connectors

We have taken the standard housing configuration of the P1 & P3 mounting dimensions while incorporating true differential pair contacts within the P1 & P3 dimensional constraints. P1 connector housing contains 21 position true differential pair blind mate contacts allowing board designers to carry high density differential pair signals from the LRU via motherboard to daughter-card plug in  modules with a single connector P1 type housing.

Brochure

Features & Benefits

  • Use of standard VME bus architecture cages for high speed fibre channel connection.
  • Bandwidth: Up to 3 Gigahertz
  • P1 and P3 Mounting dimensions
  • Board to board high speed data transfer
  • Matched Impedance Differential Pair Twinax & Quadrax
  • Data sampling rates exceeding 2 Gbits/second
  • 21 position true differential pair blind mate contacts
  • 150 and 100 Ohm matched impedance

Related Products

  • Image of Fibre Channel D-Sub

    Fibre Channel D-Sub

    Utilizing a multi-finger ground spring fixed around the shell to provide a multi-point contact engagement that affords superior EMI shielding.

  • Image of Micro Quadrax/Twinax

    Micro Quadrax/Twinax

    Feature matched impedance miniaturized connectors that provide the user with controlled impedance and tightly spaced PCB footprint spacing.

Related News

  • Image of Challenges Semiconductor Package Size and Pitch Face in Shrinking Consumer Electronics

    Challenges Semiconductor Package Size and Pitch Face in Shrinking Consumer Electronics

    Tiny computers, smartphones, and small electronic devices that industry leaders and other companies have popularized are forcing the hand of semiconductor package designers to shrink the package to fit within these little hand-held gadgets. The demand for technology applications, such as smart homes, smart manufacturing, smart medical care, and automotive electronics, continues to increase. At the same time, the requirements of continuous miniaturization and functional diversification of electronic product demands also increase.

  • Image of Raising the Bar of Burn-In Testing Sockets

    Raising the Bar of Burn-In Testing Sockets

    Burn-in testing is widely used as an aid in producing failure-free electronic components. When scientifically planned and conducted, burn-in-testing sockets offer one of the most effective methods of reliability screening at the component level. Testing during production plays a vital role in ensuring reliability and repeatability. Semiconductor manufacturing plants perform tests at each stage of production to eliminate defective parts as early as possible while precisely controlling each process parameter of the chip.