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NXS Series

Ultra-High Density, Space Qualified Interconnect
Equipped with the Hypertac® hyperboloid contact technology the NXS system can withstand data rate application up to 10 Gbps (per channel) requirements, including extreme levels of vibration, shock and climatic testing above 2100 G. The NXS Series is designed in a robust construction with 4 or 12 high speed quadrax (dual-twinax) modules.
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Features & Benefits

Features
  • Low outgassing materials
  • Hyperboloid contact technology
  • Solderless PCB Termination
  • 4 and 12 bay configurations
Benefits
  • Weight savings
  • Ultra high contact density
  • Ultra low mating force
  • Withstands high shock and vibration space environments
Designed to exceed the requirements of:
  • ESCC 3401
  • ESCC 3402
  • ECSS-Q-ST-70C
  • ECSS-Q-ST-70-02
  • ECSS-Q-ST-70-08C
  • ECSS-Q-ST-70-38C
  • ECSS-Q-70-71

Overview

Today, space satellites are moving away from RF Analog based payloads providing low speed telecommunication signaling, to a new Digital Transparent Processor architecture for high throughput satellites. Those architectures increase the demand for rugged and higher speed connectivity.

To meets those industry needs, Smiths Interconnect has developed the NXS Series, an advanced high speed, high density interconnect to provide next generation data on demand. Equipped with the Hypertac® hyperboloid contact technology the NXS system can withstand data rate application up to 10 Gbps (per channel) requirements, including extreme levels of vibration, shock and climatic testing above 2100 G. The NXS Series is designed in a robust construction with 4 or 12 high speed quadrax (dual-twinax) modules.

Each ultra-high density quadrax module contains 2 dual twinax at 100 Ω each pair. It is blind mateable, hot pluggable, with ultra-low mating forces and low outgassing materials. In addition, the solderless PCB mount design reduces the customer’s risk and cost of ownership. The connector is mounted after reflow and has no impact on nearby components. Each product is engineered using 3D electromagnetic simulation (EM) software to provide excellent performance in a total thin film process.

 

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