- Intermateable and interchangeable with the standard non-filtered connectors
- Combo D-Sub arrangements for power coaxial and signal contacts mixed arrangements
- Layouts include 5W5, 8W8, 17W2, 9W1 and 24W7
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Micro-D Twinax (MDTX)
Twinax blindmate assemblies fitted into a low-profile metalized Micro-D style shell.
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Smiths Interconnect expands into burn-in test market with acquisition of Plastronics
The acquisition broadens the company’s offering and strengthens its position in the semiconductor test market.
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Smiths Interconnect expands DaVinci test socket offering
The request for increased functionality in the smallest possible footprint has led to a reduction of the pitch of integrated circuits below 500 μm. At the same time, increased performances in SoCs affect pin-to-pin noise or what is commonly called crosstalk during testing.
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Advanced Thermal Management IC Test Solutions
Utilizing state-of-the-art system simulation models allows Smiths Interconnect to optimize each lid’s design for efficient heat dissipation through a variety of cooling mechanisms.
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Ensure Reliability in Edge Computing with Burn-In Testing
Retail. Manufacturing. Government. Healthcare. Distribution. Choose an industry, and edge computing is there helping organizations thrive. Every industry has more data to generate, control, share, and save, which means that through 2022 and beyond, more enterprises will use the edge to benefit their business.