Terminals are nickel plated and solder coated or silver over nickel RoHS compliant lead free. Also available in wire bondable gold terminals Our chip attenuators are available with thick film resist, tantalum nitride or nichrome thin film resist materials. The TS04, TS07, TS09, TT9, KFA and HPCA series use thick film resistor elements. The TSX, TS03, TS05 and TS06 use tantalum Nitride thin film resistors. The devices are available for shipping in waffle pack or tape and reel packaging.
Surface mount chip attenuators are designed for direct installation on printed circuit boards. Edge metallization on two sides forms the solder fillets for stronger attachment, easier inspection, and increased heat removal area. The wire bondable devices are epoxied ore soldered ground with wire or ribbon bonded to input/output terminals. The devices are available in Alumina, Aluminum Nitride (AlN), BeO and CVD diamond. All devices are available RoHS compliant.
- Substrates - BeO, AlN, Alumina and CVD Diamond
- Commercial and High Reliability Product Lines
- Frequency Range from DC to 50 GHz
- Attenuation Values from 0 to 30dB
- Space and Military Qualified
- Surface mountable, wire bondable and coaxial configurations
| Series | Temperature Variable Thermopad Equivalent |
Frequency Range |
Max Input Power CW |
Footprint Dimensions |
|---|---|---|---|---|
| Click links below for datasheets | ||||
| TS03 TT3 (0.5dB attenuation) |
TVA | DC-12.4 GHz | 2.0 Watts | 0.122 X 0.145 (in) 3.10 X 3.68 (mm) |
| TS04 | Not Available | DC-6 GHz | 1.0 Watts | 0.125 X 0.100 (in) 3.10 X 3.68 (mm) |
|
TS05
TT5 (0.5dB attenuation) |
MTVA | DC-18 GHz | *0.75 - 5.0 Watts | 0.075 X 0.060 (in) 3.10 X 3.68 (mm) |
| TS06 | Not Available | DC-20 GHZ | *0.5 - 3.0 Watts | 0.065 X 0.035 (in) 3.10 X 3.68 (mm) |
| TS07 | AN7 | DC-6 GHz | 100 Mw | 0.080 X 0.050 (in) 3.10 X 3.68 (mm) |
| TS09 | WTVA | DC-20 GHz | 200 Mw | 0.060 X 0.075 (in) 3.10 X 3.68 (mm) |
| TT9 | WTVA | DC-20 GHz | *1.0 - 4.0 Watts | 0.060 X 0.075 (in) 3.10 X 3.68 (mm) |
| AT Series | DC-20 GHz |
100 Mw - 2 Watts |
Various | |
| TSX | Not Available | DC-50 GHz | 1-3 Watts | 0.060 x 0.040 (in) 3.10 X 3.68 (mm) |
| KFA | KTVA | 16-36 GHz | 200 Mw | 0.120 X 0.065 (in) 3.10 X 3.68 (mm) |
| * Attenuation Value Dependent | ||||
- AN0005-Chip Device Mounting Instructions
- AN0010-Proper Storage of Florida RF Labs and EMC Technology Component
- AN0018-Recommended Solder Reflow Temperature Profile for Lead-Free Parts
- AN0025-Recommended Solder Reflow Temperature Profile for Leaded Parts
- AN0028-Frequency Equalization Using Attenuators
- AN006 Wrapped Chip Device Mounting
- AT Series High Volume Chip Attenuators Brochure
- SPL Series Attenuators and Thermopad Brochure
- TS05 Series Attenuator Chip Brochure
- TS06 Series Brochure (A4)
- TS06 Series Brochure (US)
- TS03 Series Brochure
- TS09 Series Attenuator Chip Brochure
- TSX Series Brochure
- TT3 Attenuator Series Brochure
- TT5 Attenuator Series Brochure
- TT9 SMT Series Brochure (A4)
- S-Parameters - 42WXX
- S-Parameters - AT5 Series
- S-Parameters - AT7 Series
- S-Parameters - AT9
- S-Parameters - HPCA54XX
- S-Parameters - KFA Wire Bond Series
- S-Parameters - KFA-SMT
- S-Parameters - TS05 W3
- S-Parameters - TS06 Series
- S-Parameters - TS07 Series
- S-Parameters - TS09 SMT Series
- S-Parameters - TS03-W3
- S-Parameters - TSX Series
- S-Parameters - TS05
- S-Parameters - TT9XX-0SMT-Series
- S-Parameters - TSX WB2 Series