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Multi-year Contract with General Atomics to Enhance the Lynx® Radar
Smiths Interconnect announces a six-year contract to deliver a highly integrated multi-channel subsystem to support General Atomics Aeronautical Systems’ Lynx® Multi-Mode Radar in ground and maritime missions.
TSX fixed chip attenuators offer excellent broad band RF performance to 50 GHz
Smiths Interconnect delivers increased power handling in a small surface mount package.
NXS Series, New Ultra-High Density, Space Qualified Interconnect
The new NXS Series is designed to offer advanced high speed, high density interconnect solution offering next generation data on demand. Built to the highest space standards and qualified to rigorous testing and performance criteria: ESCC 3401, ESCC 3402, ECSS-Q-ST-70C, ECSS-Q-ST-70-02, ECSS-Q-ST-70-08C, ECSS-Q-ST-70-38C and ECSS-Q-70-71
Smiths Interconnect launches K-band passive components for Space applications
Highly compact and ruggedized K-band passive components are rigorously qualified for satellite communication payloads in GEO/MEO and LEO orbits.
Smiths Interconnect’s cPCI launched on NASA Mars Perseverance Rover – Interconnect Product of the Year
Smiths Interconnect proudly announces that its cPCI launched on NASA Mars Perseverance Rover has been awarded in the “Interconnection product of the year” category at the Electronics Industry Awards ceremony.
Smiths Interconnect Optical Transceivers at the heart of SES-17 satellite
The SpaceABLE® Series allows the interconnection and routing of an overall throughput of more than 15 Terabit/s and permit the use of the full Ka beam antennas bandwidth while being considerably lighter and more scalable than copper interconnects.
Smiths Interconnect launches new PCB connector for rail and industrial applications
The Intercompact Series is Smiths Interconnect’s answer to the rail and industrial market growing demand for compact, high-speed, and reliable connectivity for ECU boxes, in the respect of severe material and electric current requirements.
Kelvin Probes Provide First-Class Performance for High-volume Final Test of Standard Array and Wafer-level Devices
The unique beveled tip provides reliable, stable contact resistance for applications where chip test is critical, such as IoT, Mobile, Internet, and Automotive.
High reliability wire-bondable chip terminations in a small package
The new HR-CTX high frequency termination Series offers excellent broadband performance up to 64GHz and unrivalled power rating capability up to 5 Watts in a compact 0404 package. Its four times smaller footprint allows customers to save space and weight on the board, while the total thin film design optimized on Aluminum Nitride offers a high power dissipation.
New X-band passive components for Space and Defence
Building on fifty years of experience, Smiths Interconnect’s X-Band microstrip and coaxial components are compact, high performance and space qualified. Several products of this offering are also used in terrestrial defence applications.
Eclipse Global Connectivity, Smiths Interconnect and ST Engineering iDirect Collaborate to deliver a new Airborne ISR SATCOM capability for Mil/Gov Operators
Eclipse Global Connectivity, Smiths Interconnect and ST Engineering iDirect (iDirect) today announced their collaboration to deliver an integrated airborne Intelligence Surveillance and Reconnaissance (A-ISR) satellite communications (SATCOM) capability for military and government aircraft.
Surface mount resistors with outrigger heat sink increase power handling capabilities
The SpaceNXT HC series is specifically designed and tested to meet the space orbit environmental criteria. It is offered in a high-volume solution that leverages the Smiths Interconnect’s space heritage to improve reliability and performance over a QPL or COTS product.