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TestConX Korea
Full Conference includes all technical sessions, the EXPO, lunch, morning & afternoon tea breaks, and softcopy of the Proceedings.
Kadex
Visit Smiths Interconnect at Booth # A-336
Disposable Hypergrip® Connectors for Healthcare Devices: Premium Performance and Enhanced Safety
Limited and single-use connections for medical devices are a growing area of need. In recent times, there has been an increasing focus on developing connectors that are safe, reliable, and cost-effective for single use applications. This has been motivated by the need to reduce the risk of cross-contamination and improve hygiene in medical environments.
Key Selection Criteria for Radar System Components
Global conflicts and geopolitical tensions are driving demand for additional and more advanced radar systems. Key attributes of these systems include being “Fast to the Field”, extended long-range capability, adaptability, reliability, and having a low lifecycle cost. Selecting the right components is critical for design and manufacturing success.
OFC Conference and Exhibition
Visit Smiths Interconnect at Booth #4955
Can AI predict its own reliability? Reliability testing next gen SoC's
This webinar explores the current requirements and future needs for successfully testing the reliability of next-generation AI Accelerator processor units.
Paris Air Show/Le Bourget 2025
Visit Smiths Interconnect Hall 2b /F169
ICCAD 2024
Visit Smiths Interconnect at Booth No:K25-26
Embedded World Conference 2026
Visit Smiths Interconnect at Hall 3, Booth #3-422
How to select a RF socket that delivers high bandwidth and minimal signal loss for IC testing
Our expert will provide insights into the electrical and mechanical principles behind these sockets, explore test applications, and compare them to traditional probe sockets.
Solderless SMP Spring Loaded Connectors for High-speed Applications
This webinar will demonstrate a new product that can be used in place of solder SMPs for board to board applications. EZiCoax is a spring-loaded coax contact that can pass signals up to 40 GHz between two points. It uses an Interposer or frame for alignment and requires no tooling to implement.
SOF WEEK
Visit Smiths Interconnect at Booth #4415