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3 Results
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03 FebSmiths Interconnect: Leading the Way in Burn-In Socket Testing Solutions
As the demand for consumer electronics, AI-driven technologies, and high-performance computing rebounds, Smiths Interconnect is poised for growth. Innovations in large package sizes, high pin counts, and power consumption optimization in GPUs, CPUs, and HPCs position the company as a leader in the next generation of semiconductor testing solutions.
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01 SepOptimizing Production Test of QFN-packaged IC’s for Consumer, Automotive, Industrial and Power Applications.
Where best-in-class electrical requirements intersect with a need for a small outline, low-profile footprint, IC designers are increasingly migrating to QFN packages. Meeting these testing challenges requires a test socket solution that is robust, reliable, and electrically “clean.”
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08 AugIs it really that hard to improve chip test performance?
In the digital era, semiconductor chips are present in almost every aspect of our lives. Whether it is from microwave ovens to computers, cell phones, computer central processing units, and other electronic devices there are a variety of chips installed.