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Smiths Interconnect Blog

Keep up to date on the latest updates and industry insights with Smiths Interconnect

Challenges Semiconductor Package Size and Pitch Face in Shrinking Consumer Electronics

BGA Sockets To Solve All Your Electronics Testing Needs

Plastronics, a Smiths Interconnect technology brand, is a global provider of innovation for semiconductor reliability testing, meeting the industry’s burn-in socket needs for more than 40 years. It all started when our company invented the first open-top, application-specific socket for production burn-in of LCC packages. This innovation helped semiconductor manufacturers significantly increase their throughput and decrease costs.

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Challenges Semiconductor Package Size and Pitch Face in Shrinking Consumer Electronics

Challenges Semiconductor Package Size and Pitch Face in Shrinking Consumer Electronics

Tiny computers, smartphones, and small electronic devices that industry leaders and other companies have popularized are forcing the hand of semiconductor package designers to shrink the package to fit within these little hand-held gadgets. The demand for technology applications, such as smart homes, smart manufacturing, smart medical care, and automotive electronics, continues to increase. At the same time, the requirements of continuous miniaturization and functional diversification of electronic product demands also increase.

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Autoclavable D series

Autoclaving for Medical Devices

Autoclaving is often used to sterilize medical devices to prevent disease transmission both in new and reusable products. Autoclaves sterilize by introducing high pressure steam into a chamber containing the objects to be sterilized. Therefore, these devices must be able to withstand autoclaving temperatures in the range of 135°C without damage, deformation, or disintegration.

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