London, UK – Smiths Interconnect, a leading designer and manufacturer of IC Test Solutions for the Semiconductor Test Industry, announced today an extension to its patented DaVinci Test Socket Series for high speed test.
Designed for high speed testing of very large IC packages commonly used in gaming consoles, graphics processing and central processing units, the DaVinci series utilizes spring probe technology in a patented insulated material housing resulting in a coaxial structure with a reduced test height and low material deflection.
DaVinci 56, the latest addition to the series, is a solution for 0.8mm pitch devices, for reliable testing up to 67 GHz Analog RF / 56 Gbps NRZ Digital.
“Society’s dependence on digitalization is upon us as consumers crave convenience and reliability in their technology. Internet of Things, Autonomous Vehicles, 5G Wireless Systems and Artificial Intelligence are driving a need for high speed data transfer,” says Paul Harris, Smiths Interconnect Vice President, Sales & Marketing. “As IC technology evolves to meet these demands, Smiths Interconnect stands ready to support with solutions like DaVinci 56 which assures efficiency and accuracy in final testing of the most technologically advanced devices.”
Additional features of the DaVinci 56 include:
- Low contact resistance < 80 mΩ
- Current carrying capacity 3.0 A
- Entirely shielded signal path
- Exceptional thermal properties with socket frame acting as heat sink
- Replaceable spring probe contacts for simple in-house replacement