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Semiconductor

Proliferation of data devices and the growth of cloud computing, artificial intelligence and big data is resulting in complex systems and new materials that require rigorous, efficient validation. Smiths Interconnect’s test sockets and probe card solutions ensure superior quality and reliability in the semiconductor test applications. Our best-in-class engineering, development and technical expertise ensure support of automated, system level and development test platforms for area array, peripheral, wafer level and Package on Package (PoP) devices as well as high performance spring probe technology and cable assemblies.

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SYSTEM-ON-A-CHIP DEVICES

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KNOW?

Smiths Interconnect's Da Vinci test sockets are used to test System-on-a-chip devices, which can be integrated with baseband processors for phone and data commuication, enabling the chip to power devices like smartphones, tablets and always-connected PC's.

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SYSTEM-ON-A-CHIP DEVICES

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KNOW?

Smiths Interconnect array test products support high pin count and high speed signal applications. Our design structure ensures low power inductance, high current carrying capacity and low contact resistance embedding quality and reliability in testing of GPU's, CPU's and other high speed digital applications.

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MOBILE DEVICES

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KNOW?

Smiths Interconnect's wafer-level package testing solution, Monet, is used to test complex WiFi combo chips, providing wireless connectivity for a variety of cutting edge smartphones.

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ARTIFICIAL INTELLIGENCE

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KNOW?

Smiths Interconnect's technology is widely used for testing semiconductor products adopted in artifical intelligence - the key enabler for autonomous driving.

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INTEGRATED CHIPS

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KNOW?

As phones and smart devices get more powerful, so do the integrated chips that support them. Smiths Interconnect's innovative test solutions help customers deliver higher quality products by ensuring the chips in them perform as they should.

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Semiconductor Test Applications

Area Array Test

AREA ARRAY TEST

  • GPU
  • CPU
  • Artificial Intelligence
  • Deep Learning
  • High-speed Memory
  • Analog RF
Package On Package Test

PACKAGE ON PACKAGE TEST

  • Smart Phone CPU
  • Wearable Technology
  • NFC - Near Field Communications
Wafer Level Test

WAFER LEVEL TEST

  • Bluetooth
  • Wi-Fi
  • Power Management
Peripheral Package Test

PERIPHERAL PACKAGE TEST

  • Wireless Communications
  • Infotainment
  • Automotive
  • Industrial

Success Story

Increasing Digital Reliability

As computers, mobiles and smart devices become more advanced, so must the integrated chips that support them. Smiths Interconnect’s new Volta semiconductor test solutions, are leading the way. These solutions are used for testing the integrated chip packages behind everything from Bluetooth and power management to digital displays. Volta significantly outperforms the competition in both durability and performance.

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