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Proliferation of data devices and the growth of cloud computing, artificial intelligence and big data is resulting in complex systems and new materials that require rigorous, efficient validation. Smiths Interconnect’s test sockets and probe card solutions ensure superior quality and reliability in the semiconductor test applications. Our best-in-class engineering, development and technical expertise ensure support of automated, system level and development test platforms for area array, peripheral, wafer level and Package on Package (PoP) devices as well as high performance spring probe technology and cable assemblies.

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Area Array Test

Area Array Test

  • GPU
  • CPU
  • Artificial Intelligence
  • Deep Learning
  • High-speed Memory
  • Analog RF
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Package On Package Test

Package On Package Test

  • Smart Phone CPU
  • Wearable Technology
  • NFC - Near Field Communications
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Wafer Level Test

Wafer Level Test

  • Bluetooth
  • Wi-Fi
  • Power Management
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Peripheral Package Test

Peripheral Package Test

  • Wireless Communications
  • Infotainment
  • Automotive
  • Industrial
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3D Market Animations. Click on the touchpoints below to see how our products fit into each application.

Success Story

Increasing Digital Reliability

As computers, mobiles and smart devices become more advanced, so must the integrated chips that support them. Smiths Interconnect’s new Volta semiconductor test solutions, are leading the way. These solutions are used for testing the integrated chip packages behind everything from Bluetooth and power management to digital displays. Volta significantly outperforms the competition in both durability and performance.

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Test Solutions

We provide our customers with a competitive advantage when tackling the challenges of higher power, increased data rates, wider bandwidth, and greater connectivity all within a smaller footprint.