NEWS Mar 02 2020 High performance wire bondable chip terminations High power and frequency chip terminations in a compact, lightweight design Smiths Interconnect launches the new CTX series, offering high performance in a small package.
Latest Tweet Find out more about our connectors offering for extreme environments in Harsh-Environment Connectivity eBook…https://t.co/J5YACDHNe5
Mar 03 2020 Distribution agreement with Heilind... The agreement with Heilind Inc. completes the business relationship already existing with Heilind...
Mar 02 2020 High performance wire bondable chip... High power and frequency chip terminations in a compact, lightweight design Smiths Interconnect...
Feb 13 2020 SpaceNXT™ MWC Space Tested and... Addressing the need to create a streamlined procurement experience by shifting the testing...
Jan 08 2020 Success of COSMO-SkyMed Programme Smiths Interconnect's spring probe contact technology ensures the signal integrity of core...
Jan 02 2020 Enhancing Customer Efficiency with... New Volta 200 Series Offers Easy Maintenance of Spring Probe Technology for Finest Pitch Wafer Test