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Challenges Semiconductor Package Size and Pitch Face in Shrinking Consumer Electronics

BGA Sockets To Solve All Your Electronics Testing Needs

Plastronics, a Smiths Interconnect technology brand, is a global provider of innovation for semiconductor reliability testing, meeting the industry’s burn-in socket needs for more than 40 years. It all started when our company invented the first open-top, application-specific socket for production burn-in of LCC packages. This innovation helped semiconductor manufacturers significantly increase their throughput and decrease costs.

Ensure Reliability in Edge Computing with Burn-In Testing

Retail. Manufacturing. Government. Healthcare. Distribution. Choose an industry, and edge computing is there helping organizations thrive. Every industry has more data to generate, control, share, and save, which means that through 2022 and beyond, more enterprises will use the edge to benefit their business.

Custom Connectors VS Catalog Connectors: Benefit Breakdown and Challenges

There's no escaping the expectations to create more compact electronic components with higher functionality. Designing shrinking electronics is a challenge for all electronics manufacturers. Whatever industry you're in and no matter if you’re creating consumer, business, or military-grade electronics, there is a demand for building smaller, smarter, and sturdier electronics.

Rethinking Blind Mate Connectors to Increase Reliability in Miniaturized Electronics Assembly

Creating more compact electronic components with higher functionality is a challenge for all electronics manufacturers. Whatever industry you're in, creating consumer, business, or military-grade electronics, the challenge presents itself, and the stakes are high. As electronics are expected to continue shrinking while increasing capabilities, blind mating connectors are required to meet those same size and functionality requirements.

Raising the Bar of Burn-In Testing Sockets

Burn-in testing is widely used as an aid in producing failure-free electronic components. When scientifically planned and conducted, burn-in-testing sockets offer one of the most effective methods of reliability screening at the component level. Testing during production plays a vital role in ensuring reliability and repeatability. Semiconductor manufacturing plants perform tests at each stage of production to eliminate defective parts as early as possible while precisely controlling each process parameter of the chip.

Dundee site qualification and test laboratory general purpose test area.

One-stop-shop laboratory replicates deep space environment

Space flight hardware is exposed to severe shock, vibration, thermal variations and electromagnetic environments that start with launch and continue throughout its operational lifetime. Environmental tests expose the hardware to these environments in a simulation laboratory to validate the design, screen for manufacturing defects and ensure the reliability and survivability of flight hardware.

High-Power Burn-In Testing in 2023: How to Overcome the Extreme

The tech zeitgeist is all about the extreme. The more advanced our devices become by the day, the more they evolve – and consumers’ expectations with them.

Are X-Band Lowpass RF Filters right for you?

The X-Band cutoff frequency range is from 8 GHz to 12 GHz with a wavelength of 3.8 to 2.5 cm.

Improving time- and cost- efficiency in reliability burn-in testing

When companies develop new devices, they must ensure there are no failures in the field. This means that thorough reliability burn-in testing must take place from the start to avoid malfunctions down the road.

Optimizing Production Test of QFN-packaged IC’s for Consumer, Automotive, Industrial and Power Applications.

Where best-in-class electrical requirements intersect with a need for a small outline, low-profile footprint, IC designers are increasingly migrating to QFN packages. Meeting these testing challenges requires a test socket solution that is robust, reliable, and electrically “clean.”

Exploring the Cutting-Edge SpaceABLE® Radiation-Resistant Embedded Optical Transceivers

Space missions expose electronic components to intense radiation, a challenge that can compromise the functionality of conventional devices. However, Smiths Interconnect's SpaceABLE® line of products is purposefully designed to withstand these extreme conditions.

Revolutionizing Medical Devices with High-Density D04 Connectors

With the growing popularity of portable and patient-wearable devices, the size and weight of connectors have suddenly taken center stage in the medical sector.

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