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RF Filter Based Passive Multi-Function Assemblies for Mission Critical Applications

RF Filter Based Passive Multi-Function Assemblies for Mission Critical Applications

The objective of this webinar is to share the concept of RF filter-based passive multi-function assemblies (MFA). Examples are provided that incorporate such functions as transitions, RF filters, ferrite isolators, non-directional couplers and high-power terminations that illustrate the advantages and the pitfalls that can readily be avoided.

DaVinci Micro

Challenges for Test Sockets Running at 224 Gbps Data Rates

In this webinar we will discuss the challenges in designing and manufacturing an electro-mechanical interface for testing a Integrated Circuit running at 224 Gbps data rates. We will discuss the roadblocks in working in a fully simulated environment and our products that are capable of meeting next generation Integrated Circuit requirements.

High-density circular connectors for life-critical medical devices

Selecting the Right Connectivity Solutions for Electrophysiology and Imaging Devices

This webinar will cover the current and emerging trends in the medical device industry overall, with a special focus on imaging and interventional, including electrophysiology. Our experts will particularly focus on applications where demand for smaller, lighter, and more flexible connectors is increasing for next generation devices in the areas of tissue ablation, cardiac mapping, and imaging.

Electrification & Sustainability

New Premium Hyperboloid High Power contacts for reduced power loss in Battery Systems

Smiths Interconnect is proudly introducing Hypertac Green Connect, an advanced design of the hyperboloid contact to solve the absolute fundamental problem of power loss to allow the battery use every kWh of energy efficiently. In this webinar we'll discuss about the current market situation and what our product would do to solve the issue. 

HR TSX Series Attenuators

Selecting Passive Temperature Compensation in RF Circuits

This webinar will address customer’s needs for RF board level devices and components requiring temperature compensation that increases product performance & adds reliability for their mission critical applications and programs.