The breadth of waveguide products includes devices operating from 1.0 to 52.0 GHz and includes isolators and circulators, combiners, transitions and terminations. Each product is designed for specific applications and optimized to handle an appropriate amount of RF power. The highest power devices are based on differential phase shift technology while lower power devices are supplied based on traditional junction technology, Smiths Interconnect offers a broad choice of standard junction and differential 4-port waveguide isolators and circulators.

The SpaceNXT™ MWC Series is a high reliable 2-way Ku-Band isolated splitter, specifically designed and tested for space applications from MEO/GEO satellites to deep space probes.

High performance, compact, light-weight solutions for critical RF filtering in X-band, Ku-band, and Ka bands.

Totally passive, surface mountable temperature variable attenuator. It requires no bias or control voltages and does not generate distortion.

Standard probe series for 0.075" (1.91 mm) pitch includes multiple length, travel, ICT, lead free and rotator options.

Double-Ended Coaxial Probe. Our coaxial probes provide a low noise, controlled impedance signal path with reliable and easy connect/disconnect options.

Conformable cables (hand formable) have a tin filled braid with a metal foil underlay and is also available in the same diameters as the Semi-Rigid type.

Specifically designed for space flight applications on LEO, MEO, and GEO satellites and offered with standardized testing sequences, reducing delivery times and overall cost of ownership.

Modular plastic circular connectors designed for commercial aviation, medical and industrial markets

Four contact row, high density signal connector platform designed for high performance applications in harsh environments.

Complete line of high powered EMI filtered D-Sub connectors including the single row size #8 power contacts (3W3, 3WK3, etc.).

Data sampling rates exceeding 2 Gbits/second can be driven via matched impedance differential pair interconnections for board-to-board high speed data transfer as well as blind mate I/O plug in modular applications.