KMC Series

High-density board to board and board to wire interconnect solutions available in multiple configurations from 26 to 162 positions with a 0.5mm contact diameter and is widely used in harsh environments.

MDD Series

The MDD is a metal shell connector available with a 100 and 200 signal contacts configuration. With a 0.5mm contact diameter, with straight, surface mount tail and 90° termination styles. The metal shell improves system reliability by ensuring high levels of shock and vibration and by eliminating contact fretting, hence reducing wear rates, and avoiding system failure and down-times.

HPH Series

HPH is suitable for the most demanding Commercial Aerospace, Defense and Industrial applications.

C9394 Series

Available in 132 through 594 positions, that can be configured to include fiber optic and coax options.

The anatomy of a microstrip isolator and circulator

Understanding the basics of microwave microstrip isolator and circulator technologies

Overcome Challenges in Embedded Optical Interconnects Design

The above article has outlined the advantages and challenges of using fiber optical interconnects. To use fiber optic cables, the electrical signals need to be converted to light signals using fiber optic transceivers. While there are many challenges to embedded fiber optics design, the benefits are substantial. The guidelines and design check list provided will help developers select the best solutions for their needs.

Smiths Interconnect awards top distributors for 2022

The distribution award initiative recognizes and celebrates the business partners whose efforts have contributed to advancing Smiths Interconnect’s business respectively in the Americas, EMEA and Asia. Winners were selected as best performing distributors in terms of sales growth compared to the previous year.

Power Connector: the critical weak point? There’s a proven solution

Power connectors are a critical weak point in high‑current battery systems. Discover how advanced hyperboloid contact technology reduces power loss, heat and reliability risks in demanding applications.