KMC Series

High-density board to board and board to wire interconnect solutions available in multiple configurations from 26 to 162 positions with a 0.5mm contact diameter and is widely used in harsh environments.

MDD Series

The MDD is a metal shell connector available with a 100 and 200 signal contacts configuration. With a 0.5mm contact diameter, with straight, surface mount tail and 90° termination styles. The metal shell improves system reliability by ensuring high levels of shock and vibration and by eliminating contact fretting, hence reducing wear rates, and avoiding system failure and down-times.

HPH Series

HPH is suitable for the most demanding Commercial Aerospace, Defense and Industrial applications.

C9394 Series

Available in 132 through 594 positions, that can be configured to include fiber optic and coax options.

Smiths Interconnect Enhances Online Experience with Direct Distributor Inventory Search

This innovative tool streamlines the purchasing process, enabling customers to quickly find, compare, and procure Smiths Interconnect products by searching distributor stock directly on the company’s website.

Smiths Interconnect supports NASA’s Europa Clipper mission to explore Jupiter’s moon, Europa

Key connectivity components from Smiths Interconnect are used in the mission, which has the goal of identifying whether Europa can support life.

Overcome Challenges in Embedded Optical Interconnects Design

The above article has outlined the advantages and challenges of using fiber optical interconnects. To use fiber optic cables, the electrical signals need to be converted to light signals using fiber optic transceivers. While there are many challenges to embedded fiber optics design, the benefits are substantial. The guidelines and design check list provided will help developers select the best solutions for their needs.

Meeting the increasing demand for rugged, high-speed connections in Space applications.

Space satellites market is evolving from RF Analog-based payloads providing low speed telecommunication signaling, to a new Digital Transparent Processor architecture for high throughput satellites. This type of architecture increases the demand for rugged and higher speed connectivity.