KMC Series

High-density board to board and board to wire interconnect solutions available in multiple configurations from 26 to 162 positions with a 0.5mm contact diameter and is widely used in harsh environments.

MDD Series

The MDD is a metal shell connector available with a 100 and 200 signal contacts configuration. With a 0.5mm contact diameter, with straight, surface mount tail and 90° termination styles. The metal shell improves system reliability by ensuring high levels of shock and vibration and by eliminating contact fretting, hence reducing wear rates, and avoiding system failure and down-times.

HPH Series

HPH is suitable for the most demanding Commercial Aerospace, Defense and Industrial applications.

C9394 Series

Available in 132 through 594 positions, that can be configured to include fiber optic and coax options.

New Volta 180 supports Wafer Level Packages and Known Good Dies test businesses

The new Volta 180 Series is an advanced WLCSP test solution that expands Volta product line to include the compact 180um pitch, allowing for a higher number of chips to be tested on each wafer. It allows for a fast and reliable testing of wafers to ensure that they meet specifications and perform as they should, which translates into higher quality end products.

High-Power Burn-In Testing in 2023: How to Overcome the Extreme

The tech zeitgeist is all about the extreme. The more advanced our devices become by the day, the more they evolve – and consumers’ expectations with them.

Test Laboratory Expansion in Suzhou

The Centre of Excellence will offer a one-stop-shop to the global customer base for the products used in semiconductor test applications.

Is it really that hard to improve chip test performance?

In the digital era, semiconductor chips are present in almost every aspect of our lives. Whether it is from microwave ovens to computers, cell phones, computer central processing units, and other electronic devices there are a variety of chips installed.