High Density PCB Connectors
KMC Series includes high-density board to board and board to wire interconnect solutions available in multiple configurations from 26 to 162 positions with a 0.5mm contact diameter and is widely used in harsh environments. Space grade/ESA/ESCC qualified are also available.
KMC Series comes in 3 rows mixing signal, power, and coaxial contacts. Using the hyperboloid contact technology, the KMC series features with low contact resistance while ensuring more than 5000 mating cycles.
High density connectors equipped with signal and HE 807 cavities for power and coaxial contacts. The MHD connector is ESA qualified
Four contact row, high density signal connector platform designed for high performance applications in harsh environments.
With more than 2,500 configurations, the KA Series provides design flexibility not available with other MIL-DTL-55302 connectors.
Designed as high reliability printed circuit board connectors offering pin counts from 17 to 490 contacts which are widely used in defense, commercial aerospace and space applications.
The HYPER Series catalogue offers 51 hyperboloid contacts in 14 different pin dimensions, from 0.4mm diameter for signal contacts to 6.12 mm for high currents, with different termination types (crimp, solder cup, straight, open both ends and closed end) and platings.
Smiths Interconnect’s site in Genoa has been registered under the manufacturers of components qualified to the rules of the ESCC System and intended for use in ESA and other spacecraft and associated equipment - in accordance with ESCC
The new D04 connectors offer high density while maintaining high cycle life.
The agreement with Heilind Inc. completes the business relationship already existing with Heilind in Europe and Asia, making the company a global partner for the distribution of Smiths Interconnect’s products.
