High Density PCB Connectors
KMC Series includes high-density board to board and board to wire interconnect solutions available in multiple configurations from 26 to 162 positions with a 0.5mm contact diameter and is widely used in harsh environments. Space grade/ESA/ESCC qualified are also available.
KMC Series comes in 3 rows mixing signal, power, and coaxial contacts. Using the hyperboloid contact technology, the KMC series features with low contact resistance while ensuring more than 5000 mating cycles.
The MDD is a metal shell connector available with a 100 and 200 signal contacts configuration. With a 0.5mm contact diameter, with straight, surface mount tail and 90° termination styles. The metal shell improves system reliability by ensuring high levels of shock and vibration and by eliminating contact fretting, hence reducing wear rates, and avoiding system failure and down-times.
Four contact row, high density signal connector platform designed for high performance applications in harsh environments.
With more than 2,500 configurations, the KA Series provides design flexibility not available with other MIL-DTL-55302 connectors.
Designed as high reliability printed circuit board connectors offering pin counts from 17 to 490 contacts which are widely used in defense, commercial aerospace and space applications.
The HYPER Series catalogue offers 51 hyperboloid contacts in 14 different pin dimensions, from 0.4mm diameter for signal contacts to 6.12 mm for high currents, with different termination types (crimp, solder cup, straight, open both ends and closed end) and platings.
Smiths Interconnect’s site in Genoa has been registered under the manufacturers of components qualified to the rules of the ESCC System and intended for use in ESA and other spacecraft and associated equipment - in accordance with ESCC
In the realms of space exploration and defense technology, electronic components play a pivotal role in ensuring mission success and national security. Among these components, fixed attenuators stand out as essential tools for signal management, maintaining the integrity of electronic systems amidst the most challenging environments
The landscape of high-speed radio frequency (RF) interconnects is continuously evolving, driven by the need for enhanced performance, simplified assembly, and improved durability. For decades, the Subminiature Push-On (SMP) connector has been a staple in many RF applications. However, a new, solder-less, spring-loaded solution, EZiCoax, offers significant advantages over traditional SMP contacts, particularly in complex, board-to-board architectures.
