Skip to content
Login Register

MDD Series

High density PCB Connectors

Featuring the Hypertac® hyperboloid contact technology, MDD Series are high density board to board interconnects. MDD is available in 100 and 200 positions.

Download Brochure 2D/3D Configure

Features & Benefits

  • Signal contacts
  • Housing with ruggedized metal shell
  • High density: 100 and 200 signal contacts
  • Featuring Hypertac Hyperboloid contact technology

Overview

The MDD Series has been designed to resist the high levels of shock and vibrations in the harshest environments of the Commercial Aerospace. The MDD is a metal shell connector available with a 100 and 200 signal contacts configuration. With a 0.5mm contact diameter, with straight, surface mount tail and 90° termination styles. The metal shell improves system reliability by ensuring high levels of shock and vibration and by eliminating contact fretting, hence reducing wear rates, and avoiding system failure and down-times.

Documents & Literature

Related Products

  • Image of HDLP

    HDLP

    HDLP range of rectangular PCB connectors, designed for use in space-constrained applications.

Related News

  • Image of 28G rugged embedded optical modules

    28G rugged embedded optical modules with integrated CDR.

    New line of rugged optical modules offering up to 28 Gbps per lane for defense applications. This line of optical modules consists of  the LightABLE28™ mid-board transceiver and the LightCONEX28™ active optical blind mate connector.

  • Image of One World Web Coverage

    The Internet of Space and radiation resistant transceivers

    The explosion of worldwide communications over the past 25 years has led to the pervasive use of mobile and land communications equipment with an abundance of platforms, applications, and devices all driving the growth of many of the largest businesses in the world. There is no doubt that this trend will continue through the Internet of Things (IoT), and the arrival of the 5G technology along with improvements to the underlying network infrastructure. However, the next, ‘Small Step’ for man in terms of ubiquitous communications will be the ‘Giant Leap’ into the Internet of Space.