- Intermateable and interchangeable with the standard non-filtered connectors
- Combo D-Sub arrangements for power coaxial and signal contacts mixed arrangements
- Layouts include 5W5, 8W8, 17W2, 9W1 and 24W7
-
Micro-D Twinax (MDTX)
Twinax blindmate assemblies fitted into a low-profile metalized Micro-D style shell.
-
High-Power Burn-In Testing in 2023: How to Overcome the Extreme
The tech zeitgeist is all about the extreme. The more advanced our devices become by the day, the more they evolve – and consumers’ expectations with them.
-
Smiths Interconnect unveils 2023 Distributors of the Year
The distribution awards initiative celebrates business partners who have contributed to the growth of Smiths Interconnect's business across the 3 regions in which it operates: Americas, EMEA and Asia.
-
Kelvin Probes Provide First-Class Performance for High-volume Final Test of Standard Array and Wafer-level Devices
The unique beveled tip provides reliable, stable contact resistance for applications where chip test is critical, such as IoT, Mobile, Internet, and Automotive.
-
Challenges Semiconductor Package Size and Pitch Face in Shrinking Consumer Electronics
Tiny computers, smartphones, and small electronic devices that industry leaders and other companies have popularized are forcing the hand of semiconductor package designers to shrink the package to fit within these little hand-held gadgets. The demand for technology applications, such as smart homes, smart manufacturing, smart medical care, and automotive electronics, continues to increase. At the same time, the requirements of continuous miniaturization and functional diversification of electronic product demands also increase.