- Twist protection pin
- Multimode applications
- Screw lock mechanism
- Low insertion loss: -0.20 dB (typical)
- Featuring Sabritec technology
The acquisition broadens the company’s offering and strengthens its position in the semiconductor test market.
Optimizing Production Test of QFN-packaged IC’s for Consumer, Automotive, Industrial and Power Applications.
Where best-in-class electrical requirements intersect with a need for a small outline, low-profile footprint, IC designers are increasingly migrating to QFN packages. Meeting these testing challenges requires a test socket solution that is robust, reliable, and electrically “clean.”
The Centre of Excellence will offer a one-stop-shop to the global customer base for the products used in semiconductor test applications.
Smiths Interconnect Offers Quick-Delivery Galileo Test Socket for Rapid Device Bring Up, Characterization, and Failure Analysis
Galileo is an innovative, low-profile test socket engineered to support today’s high performance Digital and RF applications. It leverages proven interposer elastomer technology and advanced 3D printing manufacturing to provide a high-performance solution for BGA, LGA, QFP, SOIC, or QFN packaged devices with extremely short lead times.