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- Spring loaded for optimum contact mating force
- High frequency performance
- Low VSWR
- Size 8: 1.15:1 Typ Mated Pair (DC to 26.5 GHz)
- Size 12: 1.25:1 Typ Mated Pair (DC to 26.5 GHz)\
- 1.5:1 Typ Mated Pair (26.5 - 40 GHz)
- Insertion Loss:
- 0.15 dB to 26.5 GHz Typ (Size 8)
- 0.2 dB to 40 GHz Typ (Size 12)
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Test Laboratory Expansion in Suzhou
The Centre of Excellence will offer a one-stop-shop to the global customer base for the products used in semiconductor test applications.
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Volta Product Pushes Testing Technology Boundaries
A High Performance, Cost-effective Alternative in Wafer Level Chip Scale Package Testing
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Smiths Interconnect expands into burn-in test market with acquisition of Plastronics
The acquisition broadens the company’s offering and strengthens its position in the semiconductor test market.
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Smiths Interconnect honored as Outstanding Test and Measurement Company of the Year at the China IC Achievement Award
Smiths Interconnect, a leading provider of innovative test solutions for the semiconductor industry, won the China IC achievement award as the Outstanding Test and Measurement Company of the Year for its continuous innovation and rapid growth in the Chinese market.