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KMC Series

High Density PCB Connectors

KMC Series includes high-density board to board and board to wire interconnect solutions available in multiple configurations from 26 to 162 positions with a 0.5mm contact diameter and is widely used in harsh environments. Space grade/ESA/ESCC qualified are also available.

Features & Benefits

  • High density interconnection, up to 162 ways
  • Termination styles: wire wrap, solder cup and through board solder
  • NF C-UTE C 93-424, ESA/ESCC3401/016 - 3401/017
  • Polarized guiding devices, 16 keys available
  • Fretting proof - endurance

Overview

KMC Series comes in 3 rows mixing signal, power, and coaxial contacts. Using the hyperboloid contact technology, the KMC series features with low contact resistance while ensuring more than 5000 mating cycles.
 

Documents & Literature

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