Skip to content

Film Cards

Smiths Interconnects 73 series High Frequency Film Cards are designed to offer accurate and repeatable dissipation of low Radio Frequency power signals. We offer a complete line of standard and custom wave-guide attenuator elements. Deposition of thin film metallization on a specific substrate with an optical grade finish produces an extremely stable resistive film. A protective coating is evaporated over the resistive film to prevent oxidation. Controlled processes throughout production ensure repeatability.

Download Brochure

Related News

  • Image of High reliability wire-bondable chip terminations in a small package

    High reliability wire-bondable chip terminations in a small package

    The new HR-CTX high frequency termination Series offers excellent broadband performance up to 64GHz and unrivalled power rating capability up to 5 Watts in a compact 0404 package. Its four times smaller footprint allows customers to save space and weight on the board, while the total thin film design optimized on Aluminum Nitride offers a high power dissipation.

  • Image of New EMI Flange for NXS Connectors

    New EMI Flange for NXS Connectors

    The new EMI flange reduces the electromagnetic interference on the NXS connectors, which is crucial in high-speed space applications where data integrity is vital.

  • Image of NXS Series, New Ultra-High Density, Space Qualified Interconnect

    NXS Series, New Ultra-High Density, Space Qualified Interconnect

    The new NXS Series is designed to offer advanced high speed, high density interconnect solution offering next generation data on demand. Built to the highest space standards and qualified to rigorous testing and performance criteria: ESCC 3401, ESCC 3402, ECSS-Q-ST-70C, ECSS-Q-ST-70-02, ECSS-Q-ST-70-08C, ECSS-Q-ST-70-38C and ECSS-Q-70-71