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Smiths Interconnect is a leading provider of chip attenuators offering the widest selection of products from DC to Q-band, backed by proven performance and significant heritage. Chip components are offered on Alumina, Aluminum Nitride, Beryllium Oxide and CVD Diamond for a wide range of applications.
The TSX Series of chip attenuators pushes the boundaries of Size, Weight and Power in a cost effective, easy to implement surface mount solution, suitable for a wide array of applications. The TSX series offers excellent broadband RF performance to 50 GHz while delivering increased power handling in a small surface mount format factor.
Features & Benefits
- Small form factor - Reduce overall footprint
- Surface Mountable – Ideal for pick and place applications
- Broad Frequency Range – Reduces BOM count
- Low VSWR – Increases transmitted power
- Wide Range of Attenuation Values – 1-10, 15 and 20dB
- Tight Attenuation Tolerance – For optimal performance
Applications
- Amplifier Circuits
- Transmit/Receive Modules
- Up/Down Converters
- Instrumentation
- Satellite Communications
- Radar
- 5G
Want to Learn More
Download the TSX brochure to find technical characteristics and ordering irformation. You can also submit your questions to our technical team or request a virtual meeting to discuss how TSX can fit into your application.
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Fixed Attenuators - Small Signal
Available in a low power chip package as well as a 0.250 sq high power BeO package.
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Thermopad®
Totally passive, surface mountable temperature variable attenuator. It requires no bias or control voltages and does not generate distortion.