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TSX Series

High Frequency Surface Mountable Chip Attenuators

Smiths Interconnect is a leading provider of chip attenuators offering the widest selection of products from DC to Q-band, backed by proven performance and significant heritage. Chip components are offered on Alumina, Aluminum Nitride, Beryllium Oxide and CVD Diamond for a wide range of applications.

The TSX Series of chip attenuators pushes the boundaries of Size, Weight and Power in a cost effective, easy to implement surface mount solution, suitable for a wide array of applications. The TSX series offers excellent broadband RF performance to 50 GHz while delivering increased power handling in a small surface mount format factor.

The chip attenuator design offers 1 to 3 watts of power handling performance and multiple attenuation values are available for surface mounting. The use of a robust, proven all thin film proces technology on an alumina substrate provides a product suitable for harsh environments, such as those of Space and Defense applications.

Features & Benefits

  • Small form factor - Reduce overall footprint
  • Surface Mountable – Ideal for pick and place applications
  • Broad Frequency Range – Reduces BOM count
  • Low VSWR – Increases transmitted power
  • Wide Range of Attenuation Values – 1-10, 15 and 20dB
  • Tight Attenuation Tolerance – For optimal performance


  • Amplifier Circuits
  • Transmit/Receive Modules
  • Up/Down Converters
  • Instrumentation
  • Satellite Communications
  • Radar
  • 5G

Want to Learn More?

Download the TSX brochure to find technical characteristics and ordering irformation. You can also submit your questions to our technical team or request a virtual meeting to discuss how TSX can fit into your application.

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