Advanced Thermal Management IC Test Solutions

Smiths Interconnect, a leading designer and manufacturer of IC Test Solutions for the Semiconductor Test Industry, announced today enhancements to its Thermal Management Solutions offering.

Utilizing state-of-the-art system simulation models allows Smiths Interconnect to optimize each lid’s design for efficient heat dissipation through a variety of cooling mechanisms. Traditional solutions including finned and liquid cooled heatsinks have been industry staples for many years but are limited in the amount of power they can support. 

Smiths Interconnect has refined these options by introducing a Hi-Perform Liquid Cooled lid integrated with a Chiller as well as a Heatpipe | Heatsink variant.  These next generation solutions expand testing capabilities through the ability to dissipate 650 Watts. These lids stabilize the junction temperature within a desired range allowing for IC testing at a higher thermal power point for a longer duration resulting in a more accurate test.

“As next generation logic IC packages, central processing units (CPU) and graphic processing units (GPU) become more powerful they are generating an exponentially increasing amount of heat,” says Paul Harris, Sales & Marketing VP at Smiths Interconnect. “IC manufacturers and test houses must surmount thermal management challenges whilst maintaining low test costs, ensuring accurate test results and improving test throughput.  Smiths Interconnect is positioned as a vital partner to meet these challenges with our thermal management solutions.”

Smiths Interconnect Thermal Management Solutions are developed specifically to a user’s exact application and can provide these additional benefits:

• Compatibility with conventional socket and lid mounting design footprints allowing for simple conversion to an enhanced thermal management solution increasing test accuracy.
• A compact, table-top chiller unit consuming minimal space in a test lab.
• Utilizes existing test hardware, coolant mediums and air inlets, thereby requiring minimal investment for integration while reducing overall cost of test.

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