Sponsored by: RFMW and Smiths Interconnect

Abstract:

The acceleration of demand for communication and data transmission in the digital age is creating a huge market for broadband connectivity. Higher power ratings and broadband performance are needed to support a wide range of applications.

The new TSX Series is designed to offer excellent broadband performance up to 50 GHz, while delivering increased power handling in a small 0604 surface mount package. It allows wider coverage than traditional components while providing optimized return loss for multiple frequency ranges. This allows the customer to use a single chip in multiple applications, reducing the Bill of Material (BOM) item count and consequently, the cost of ownership.