- Use of standard VME bus architecture cages for high speed fibre channel connection.
- Bandwidth: Up to 3 Gigahertz
- P1 and P3 Mounting dimensions
- Board to board high speed data transfer
- Matched Impedance Differential Pair Twinax & Quadrax
- Data sampling rates exceeding 2 Gbits/second
- 21 position true differential pair blind mate contacts
- 150 and 100 Ohm matched impedance
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Rugged D-Sub with Twinax/Quadrax contacts
Split pair quadrax is the next generation contact that provides robust high-speed performance compatible with existing qualified rugged D-Sub connectors.
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Fibre Channel D-Sub
Utilizing a multi-finger ground spring fixed around the shell to provide a multi-point contact engagement that affords superior EMI shielding.
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Micro Quadrax/Twinax
Feature matched impedance miniaturized connectors that provide the user with controlled impedance and tightly spaced PCB footprint spacing.
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What is thermal simulation and why is it important to reliability burn-in testing?
Not every semiconductor manufacturer utilizes thermal simulation in their reliability testing setup. Lower power burn-in allows for an acceptable temperature rise within the package/die in a traditional burn-in chamber running at 125°C. As packages in burn-in are moving to higher power output, socket and burn-in systems may need to have enhanced features to manage the desired target die temps.
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Kelvin Probes Provide First-Class Performance for High-volume Final Test of Standard Array and Wafer-level Devices
The unique beveled tip provides reliable, stable contact resistance for applications where chip test is critical, such as IoT, Mobile, Internet, and Automotive.
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Volta Product Pushes Testing Technology Boundaries
A High Performance, Cost-effective Alternative in Wafer Level Chip Scale Package Testing
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Enhancing Customer Efficiency with Volta 200
New Volta 200 Series Offers Easy Maintenance of Spring Probe Technology for Finest Pitch Wafer Test