Smiths Interconnect unveils 2023 Distributors of the Year

The distribution awards initiative celebrates business partners who have contributed to the growth of Smiths Interconnect's business across the 3 regions in which it operates: Americas, EMEA and Asia.

Challenges Semiconductor Package Size and Pitch Face in Shrinking Consumer Electronics

Tiny computers, smartphones, and small electronic devices that industry leaders and other companies have popularized are forcing the hand of semiconductor package designers to shrink the package to fit within these little hand-held gadgets. The demand for technology applications, such as smart homes, smart manufacturing, smart medical care, and automotive electronics, continues to increase. At the same time, the requirements of continuous miniaturization and functional diversification of electronic product demands also increase.

New Volta 180 supports Wafer Level Packages and Known Good Dies test businesses

The new Volta 180 Series is an advanced WLCSP test solution that expands Volta product line to include the compact 180um pitch, allowing for a higher number of chips to be tested on each wafer. It allows for a fast and reliable testing of wafers to ensure that they meet specifications and perform as they should, which translates into higher quality end products.

Smiths Interconnect expands into burn-in test market with acquisition of Plastronics

The acquisition broadens the company’s offering and strengthens its position in the semiconductor test market.