With IP67 sealing when mated, the HDLP series is particularly suitable for missile guidance and propulsion systems, ruggedized computer systems, camera or display applications, and communications panels and enclosures. Available in variants that include PCB-to-PCB, PCB-to-flying-lead and PCB-to-flex, the HDLP series is designed to reduce the PCB real estate necessary for making data connections. PCB-to-PCB options include stacking and card-edge versions, for even greater flexibility.

The connectors include an interfacial seal and encapsulated contacts to achieve a high level of sealing, with optional conformal coating available to provide further environmental integrity.