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Resistors and Terminations

Smiths Interconnect offers low and high power RF resistors and terminations including surface mount chips, tab & cover chips, flange mounted and rod types. These resistors are available with Alumina, ALN, BeO and CVD substrate materials. The  new CTX Series of high ferquency wire bondable chip teminations is optimized to combine high frequency and power in a small package.

Features & Benefits

Smiths Interconnecrt offers low and high power RF resistors including surface mount chips, tab & cover chips, flange mounted and rod types. These resistors are available with Alumina, ALN, BeO and CVD substrate materials. Some devices use a tuned circuit design to minimize parasitic capacitance across their usable frequency bands. Most devices are available in a wide range of resistance values, typically from 1 ohm to 1 K ohms.
Choose from a variety of metallization finishes for easy mounting to a heat sink or directly to the printed circuit board.  Typical finishes include: Lead-free, RoHS compliant plating (silver or gold), solder finish with SN63 or solder fused finish with SN63 depending upon package type. Select from bulk, tape & reel, or waffle packaging, again, depending upon resistor package style.

  • Lead Free, RoHS Compliant Option Available
  • Low Capacitance
  • Mounting - Surface Mount, Tab & Cover, Flange, and Rod
  • Power Levels: 0.05 to 800 Watts
  • 50 and 100 Ohms Standard
  • Tight Resistance Tolerance - +/-5%, +/-2%, and +/-1% Available
  • Tuned Circuit
  • Available in AlN, BeO, or Alumina
  • Substrate Thicknesses of .015" to .120" Available
  • Rod Diameters of .020" to .375" 
  • Custom Tab Forming Available
  • Resistance Ranges from 3 to 400 Ohms
  • Small Footprint and Low Profile

Our high power RF terminations include tab & cover, flange mounted, threaded, stripline flange, pill, coaxial remote terminations (CRT), surface mount and wire bondable types. Our tuned circuit chip designs deliver the lowest VSWR while extending frequency ranges for broadband applications. Some devices are capable of handling power up to 4KW and frequencies up to 64 GHz, in particular our new CTX series of high ferquency wire bondable chip teminations is optimized to combine high frequency and power in a small package.

  • Frequency Range from DC to 64 GHz
  • Power Handling up to 1000 Watts
  • Choose BeO, ALN, Alumina or CVD Diamond Substrates
  • Telecom Tuned Versions Available
  • Tin/Lead, Lead Free, or Solder Fused plated
  • Tape and Reel Packaging Available
  • High Reliability Versions Available
  • Tab & Cover, Flange-Mounted, Threaded, Stripline Flange, Pill, Coaxial Remote (CRT), Suface Mount and Wire-Bondable
  • S-Parameter Data Available

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