Features & BenefitsTechnical Features: For testing LGA, QFN, QFP and other variants Scrub action breaks through surface oxides on device pad Short signal path Tri-Temp socket design to support -55 °C to +150 °C Configurable design flexibility for integrating into existing hardware setups Designed for manual test, bench test, and HVM production test Insulator housing made from high-performance polyimide Small socket footprint Benefits: Long contact life, low wear, tested to over 500K insertions Provides reliable and consistent contact for Matte Tin or NiPdAu pads, low consistent Cres Exceptional signal integrity Covers wide range of test applications Match existing PCB socket footprint and test hardware lead to cost saving for customers Field repairable, easy cleaning and maintenance Low Dielectric constant, Low CLTE, exceptional Flexural Modulus Allows for PCB topside components to be placed close to DUT for better signal performance and less signal loss
Documents & Literature ArticleNew Socket Solution Optimizes Production Testing of QFN-packaged ICs - Connector Supplier3140 kB