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Kepler Test Socket

High performance scrub contact technology for Peripheral IC

The Kepler contact technology combines the scrub motion of a cantilever contact with the versatility and modularity of a spring probe. The design includes horizontal movement during the downward stroke of the device to remove surface oxides, provide stable and reliable contact, and cause no damage to the PCB.

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Features & Benefits

Technical Features:

  • For testing LGA, QFN, QFP and other variants ​
  • Scrub action breaks through surface oxides on device pad ​
  • Short signal path
  • Tri-Temp socket design to support -55 °C to +150 °C​
  • Configurable design flexibility for integrating into existing hardware setups   ​
  • Designed for manual test, bench test, and HVM production test ​
  • Insulator housing made from high-performance polyimide ​
  • Small socket footprint 


  • Long contact life, low wear, tested to over 500K insertions   ​
  • Provides reliable and consistent contact for Matte Tin or NiPdAu pads, low consistent Cres​
  • Exceptional signal integrity  ​
  • Covers wide range of test applications​
  • Match existing PCB socket footprint and test hardware lead to cost saving for customers​
  • Field repairable, easy cleaning and maintenance​
  • Low Dielectric constant, Low CLTE, exceptional Flexural Modulus​
  • Allows for PCB topside components to be placed close to DUT for better signal performance and less signal loss 

Documents & Literature

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