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Volta Series Probe Head
High performance, cost-effective, easily maintainable alternative to cantilever and vertical probe card technologies.
Kelvin Probes Solution
Unique chisel tip provides reliable, stable contact resistance for critical applications such as loT, automotive where test performance cannot be sacrificed.
Q-Series H-Pin® Socket
Available for mid to large package sizes with a fully molded socket body and lid designed to meet the rigors of a wide variety of accelerated life testing applications.
R-Series H-Pin® Socket
Open-top reliability socket used for accelerated life testing. With versions of the compression mount open-top design available as a drop-in replacement for other legacy products on the market.
H-Pin®
A stamped spring probe with the mechanical, electrical, and thermal performance of a spring probe, and the ease of use and high volume manufacturability of a stamped contact.
ESJ Series H-Pin Socket
High-performance burn-in socket, with dual latch clamshell lid to provide co-planar pressure on the DUT when the lid is actuated.
C-Series H-Pin® Socket
Modular burn-in socket with clamshell-style lid. Range of package accommodations, from 0.5 mm body size up to 12 mm and optimal socket density per burn-in board.
D Series H-Pin® Socket
Performance burn-in socket, with a clamshell-style lid that can be equipped with a heater and thermal sensor.
ES Series H-Pin® Socket
The modular lid construction can handle up to 1 kW of power and is optimized with thermal simulation to ensure out-of-the-box performance whether liquid or air cooled.
ES Micro Series H-Pin® Socket
Serving package sizes 20.0mm X 20.0mm (max) and pitch from 0.40mm – 0.65mm.
K Series H-Pin® Socket
This socket also uses the H-Pin contact technology providing wide RF performance capabilities and exceptional DC characteristics. The K-Series socket checks all the boxes: high frequency, high current, high temperature, low inductance, and Low loss.
M-Series H-Pin® Socket
The small outline footprint provides design flexibility and allows for high socket density on the burn-in board.