Product Features
- Solution for BGA, LGA, QFN and other variants
- RF Bandwidth 23-108 GHz
- Short signal path ≤ 0.9 mm
- Ability to do Impedance match signals
- Consistent stable contact resistance
- Low Inductance
- Optimized design based on test application
- Tri-Temp socket design to support -55 °C to +160 °C
- Designed for manual test, bench test, and HVM production test using the same socket
Benefits
- Design adaptation to meet requirement
- Electrically transparent signal
- Matched Impedance
- Excellent DC performance
- Application matching allows for increased yield and product life
- Cleaning is user-friendly and simple
- Precision-machined socket housing ensures robust mechanical performance
- Field repairable, easy replacement of Levan elastomer
- Match existing PCB socket footprint and test hardware lead to cost saving for customers
- Reduced delivery times over probe sockets