Product Features
- Solution for BGA, LGA, QFN and other variants​
- RF Bandwidth 23-108 GHz
- Short signal path ≤ 0.9 mm ​
- Ability to do Impedance match signals ​
- Consistent stable contact resistance​
- Low Inductance​
- Optimized design based on test application ​
- Tri-Temp socket design to support -55 °C to +160 °C​
- Designed for manual test, bench test, and HVM production test using the same socket
Benefits
- Design adaptation to meet requirement ​
- Electrically transparent signal ​
- Matched Impedance​
- Excellent DC performance ​
- Application matching allows for increased yield and product life ​
- Cleaning is user-friendly and simple​
- Precision-machined socket housing ensures robust mechanical performance ​
- Field repairable, easy replacement of Levan elastomer​
- Match existing PCB socket footprint and test hardware lead to cost saving for customers​
- Reduced delivery times over probe sockets