- Low loss, low back reflection
- General use design (no strain relief backshell needed)
- Optical disconnect style available: Standard 1.25 mm ferrule and sleeve
- Cable termination identical to LC connector process
- Easy cleaning access to the contact through removable alignment sleeve holder
- Standard ARINC 600 Size 16 insertion/removal tool
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DIN Contacts
Features of the Fiber optic DIN contacts are: twist protection pin, Multimode applications, Screw lock mechanism, Low insertion loss -0.20dB (typically)
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Raising the Bar of Burn-In Testing Sockets
Burn-in testing is widely used as an aid in producing failure-free electronic components. When scientifically planned and conducted, burn-in-testing sockets offer one of the most effective methods of reliability screening at the component level. Testing during production plays a vital role in ensuring reliability and repeatability. Semiconductor manufacturing plants perform tests at each stage of production to eliminate defective parts as early as possible while precisely controlling each process parameter of the chip.
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Kelvin Probes Provide First-Class Performance for High-volume Final Test of Standard Array and Wafer-level Devices
The unique beveled tip provides reliable, stable contact resistance for applications where chip test is critical, such as IoT, Mobile, Internet, and Automotive.
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High-Power Burn-In Testing in 2023: How to Overcome the Extreme
The tech zeitgeist is all about the extreme. The more advanced our devices become by the day, the more they evolve – and consumers’ expectations with them.
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Optimizing Production Test of QFN-packaged IC’s for Consumer, Automotive, Industrial and Power Applications.
Where best-in-class electrical requirements intersect with a need for a small outline, low-profile footprint, IC designers are increasingly migrating to QFN packages. Meeting these testing challenges requires a test socket solution that is robust, reliable, and electrically “clean.”