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Smiths Interconnect offers a broad range PCB connectors for harsh environments. A wide choice of configurations and terminations of signal, power, high speed, RF contacts and spring probes solutions.

PCB
Capabilities

Capabilities

In-house capabilities encompass design, development, manufacturing and testing. Providing operational excellence tailored to volume manufacturing requirements, global sourcing, world class engineering talent and rapid prototyping.

Hyperboloid

Hyperboloid

Hyperboloid is the original superior performing contact technology for use in demanding environments where reliability and safety are critical.

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2mm / cPCI Series

2mm / cPCI Series

Smiths Interconnect's cPCI Series offers extremely high reliability in a cPCI standard envelope.

SpaceNXT™ Aurora Series

SpaceNXT™ Aurora Series

Smiths Interconnect’s SpaceNXT™ Aurora Series, the first COTS Plus 2mm Hard Metric backplane connector, tested and qualified to ESA ESCC 3401 specifications. The SpaceNXT™ Aurora connectors have gone through extensive qualification testing to ESA ESCC 3401 specifications in order to validate today’s rigorous application requirements per customer and industry.

C9394 Series

C9394 Series

Smiths Interconnect's C9394 series is a high density, line removable module (LRM) connector available in 132 through 594 positions, that can be configured to include fiber optic and coax options.

CMD Series

CMD Series

Smiths Interconnect's versatile, high density CMD connector solution for board to board and wire to board with built in coding and keying as well as ESA qualification

Custom Spring Probe Connectors

Custom Spring Probe Connectors

The benefits of Smiths Interconnect's spring probe technology specifically designed for your application.

Custom Spring Probe Interposers

Custom Spring Probe Interposers

Smiths Interconnect's spring probes featuring IDI contact technology are specifically designed for your application.

Dovetail Connectors

Dovetail Connectors

Smiths Interconnect's Dovetail Connectors make it easy to explore the benefits of spring probe technology without the investment associated with custom tooling.

HDLP

HDLP

Smiths Interconnect's HDLP series is a low profile, high density interconnect with integral sealing

HPH Series

HPH Series

Smiths Interconnect's HPH series is a high density interconnect available up to 303 contacts with multiple hardware choices and backpotting option

HPW Series

HPW Series

Smiths Interconnect's HPW series is a versatile interconnect with mixed signal and power contacts, up to 15A each

KMC Series

KMC Series

Smiths Interconnect's KMC series is an ESA qualified, high density board to board and board to wire interconnect available in multiple configurations from 26 to 162 positions

KVPX Series

KVPX Series

Smiths Interconnect's KVPX series is the most rugged VITA compliant backplane connector on the market.

MHD/MDD/MDP Series

MHD/MDD/MDP Series

Smiths Interconnect's MHD/MDD/MDP series is an ESA qualified, high density board to board and board to wire interconnect available in up to 400 positions, with available insulators to accommodate coax and power contacts.

MIL-DTL-55302 Compliant Connectors

MIL-DTL-55302 Compliant Connectors

High reliability 55302 compliant connectors with mixed signal, power and coaxial contacts designed for defense, commercial aerospace and space demanding applications

RBA Series

RBA Series

Smiths Interconnect's RBA series is a rugged stick header that can be cut to sizes up to 27 positions

RX/Hyperstac

RX/Hyperstac

HyperStac RX Series is a Z axis interconnection solution designed for all types of micro-electronics applications requiring reliable and compact packaging solutions. The Hyperstac RX Series meets the needs of the Defence, Avionics and Space electronics applications.

Who We Are

Who We Are

Smiths Interconnect is a leading provider of technically differentiated electronic components, subsystems, microwave and radio frequency products that connect, protect and control critical applications in the commercial aviation, defense, space, medical, rail, semiconductor test, wireless telecommunications, and industrial markets.

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