Smiths Interconnect offers a broad range PCB connectors for harsh environments. A wide choice of configurations and terminations of signal, power, high speed, RF contacts and spring probes solutions.
In-house capabilities encompass design, development, manufacturing and testing. Providing operational excellence tailored to volume manufacturing requirements, global sourcing, world class engineering talent and rapid prototyping.
Hyperboloid is the original superior performing contact technology for use in demanding environments where reliability and safety are critical.
HPW series is a medium density PCB connector with mixed signal and power contacts, up to 15A each. The HPW Series has been designed to resist to the high levels of shock and vibration in the harshest environments of the commercial aerospace and defense markets.
KMC series is an ESA qualified, high density board to board and board to wire interconnect available in multiple configurations from 26 to 162 positions with a 0.5mm contact diameter and is widely used in harsh
With a 0.76mm contact diameter, the series is available up to 27 signal gold or tin plated contacts with straight PCB and cable mounting terminations. Using the Hypertac® hyperboloid contact technology,
HyperStac RX Series is a Z axis interconnection solution designed for all types of micro-electronics applications requiring reliable and compact packaging solutions. The Hyperstac RX Series meets the needs of the Defence, Avionics and Space electronics applications.
KVPX Series is an embedded interconnect system that provides unrivaled performance in harsh environments while adapting to the VITA standard design requirements. KVPX Series is a shielded, high-density, high-speed, modular interconnect system optimized for differential pair architectures on a 1.8mm x 1.35mm grid.
High reliability MIL-DTL-55302 compliant connectors offer mixed signal, power and coaxial contacts designed for defense, commercial aerospace and space demanding applications. The 2 and 3 row series are equivalent to MIL-DTL-55302 and offer flexibility not available with other interconnects.
MHD/MDD/MDP series is an ESA qualified, high density board to board and board to wire interconnect available in up to 400 positions, with available insulators to accommodate coax and power contacts.
Rugged 2mm backplane connector system is a compliant PICMG Compact PCI standard solution that provides engineers with an advanced interconnect system to address the requirements of mission-critical applications within commercial aerospace, space and defense market segments.
The first COTS Plus 2mm Hard Metric backplane connector, tested and qualified to ESA ESCC 3401 specifications. The SpaceNXT™ Aurora connectors have gone through extensive qualification testing to ESA ESCC 3401 specifications in order to validate today’s rigorous application requirements per customer and industry.
C9394 series is a high density, line removable module (LRM) connector available in 132 through 594 positions, that can be configured to include signal, power, fiber optic and coax options. The C9394 series is available with 0.6 mm contact positions from 100 to 450 (including custom solutions) with dip solder, wire wrappost and surface mount tail termination types.
Versatile, high density 4 contact row connector solution for board to board and wire to board with built in coding and keying as well as ESA qualification. With a 0.6mm contact diameter, CMD connectors are available from 42 to 316 contact positions with dip solder and SMT soldering contact termination types.
Featuring Spring Probe technology utilized in custom connector designs. Mixed signals and functionality can be designed into a single connector.
Spring probe techology utilized in custom connector designs. Mixed signals and functionality can be designed into a single connector.
Dovetail connector Series features C Series Probes, renowned for their incomparable shock and vibration performance, housed in a patent pending block design. These connectors make it easy to explore the benefits of spring probe technology without the investment associated with custom tooling.
High density, lightweight signal connector specifically designed for applications where space and weight is at a premium for board to board interconnections. The HDLP series meets the requirement of space-constrained applications that require low mating force, a high number of mating cycles, low and stable contact resistance, and excellent fretting corrosion resistance.
HPH series is a high density interconnect available up to 303 contacts with multiple hardware choices and backpotting option.With a 0.6mm contact diameter, the HPH Series comes in 3-6 row configurations and is available up to 303 signal contacts on a 1.901mm staggered grid. Contacts are removable for ease of maintenance.
Smiths Interconnect is a leading provider of technically differentiated electronic components, subsystems, microwave and radio frequency products that connect, protect and control critical applications in the commercial aviation, defense, space, medical, rail, semiconductor test, wireless telecommunications, and industrial markets.