Skip to content

HPD/HPF Series

Medium Density Signal PCB Connectors

The HPD/HPF PCB Connectors series is crafted with precision, integrating advanced Hypertac contact technology for dependable connectivity. With a lifespan of up to 100,000 insertion/extraction cycles, these connectors ensure consistent performance in challenging environments. They feature optimized power efficiency and strong high-current handling capabilities, enhancing system efficiency while maintaining reliability. Engineered to withstand tough conditions, these connectors offer robust connectivity solutions across various applications, promoting seamless operation, productivity, and long-term dependability for your systems.

Brochure

Features & Benefits

The 3-dimensional symmetry of the Hypertac contact technology design guarantees electrical continuity in all circumstances. This technology ensures durability with up to 100,000 insertion/extraction cycles.

  • Low insertion/extraction forces
  • Long contact life - perform up to 100,000 insertion/extraction cycles with minimal degradation in performance
  • Lower contact resistance
  • Higher current ratings
  • Immunity to shock & vibration

HPD/HPF Connectors Series offer a wide range of termination and guide styles. Download the brochure to read the ‘Preferred Options’ list.

Related Products

  • Image of HPH Series

    HPH Series

    HPH is suitable for the most demanding Commercial Aerospace, Defense and Industrial applications.

  • Image of HPW Series

    HPW Series

    Medium density PCB connector mixing signal and power contacts designed for harsh environments.

  • Image of HDLP

    HDLP

    HDLP range of rectangular PCB connectors, designed for use in space-constrained applications.

Related News

  • Image of One World Web Coverage

    The Internet of Space and radiation resistant transceivers

    The explosion of worldwide communications over the past 25 years has led to the pervasive use of mobile and land communications equipment with an abundance of platforms, applications, and devices all driving the growth of many of the largest businesses in the world. There is no doubt that this trend will continue through the Internet of Things (IoT), and the arrival of the 5G technology along with improvements to the underlying network infrastructure. However, the next, ‘Small Step’ for man in terms of ubiquitous communications will be the ‘Giant Leap’ into the Internet of Space.

  • Image of TSX Series

    Making Sense of High-Reliability Radio Frequency (RF ) Components

    HR TSX Series represents a significant leap forward in the realm of high-frequency surface mount chip attenuators. Its combination of small form factor, robust construction, and versatile performance make it an attractive choice for space and defense applications.