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Smiths Interconnect Awards and Recognition
Our Company
Together we drive our future through excellence in our technology, products, processes, services and people
Commercial Aerospace
Affordable, reliable, high-performance embedded optical transceivers with bandwidth up to 120 Gbps.
Defense
Rugged, MIL-Spec, onboard 120 Gbps embedded optical transmitter and receiver with high I/O density for the most demanding environment. Defense engineers are well aware that high bandwidth coax copper interconnect is too big and power hungry to meet SWaP requirements in today’s defense and applications. The LightABLE™ and LightCONEX™ families of optical embedded transceivers are extremely rugged and deliver bandwidth in excess of 120 Gbps in a chip size part.
Industrial
Affordable, reliable, high-performance embedded optical transceivers with bandwidth up to 120 Gbps.
Space
Together we drive our future through excellence in our technology, products, processes, services and people.
EMI-EMP Filter
EMI filter connectors use multi-layer ceramic capacitor arrays together with inductive materials to realize robust, high performance low pass filter networks.
Fiber Optics
multimode and single-mode fiber optic contacts. Both types consist of two basic components: the core and the cladding, which traps the light in the core
Edge Card
Designed for disposable or limited use applications where the edge-card contact module is used in the reusable connector, mating with a pcb on the disposable side.
HyperSpring® contact
Hyperspring® contacts combine our high-reliability hyperboloid contact technology, with the mechanical features of a spring-loaded contact, to produce interconnections with improved signal integrity, high reliability and current density, and proven parametric stability over time.
Custom Grid Array
Pin Grid Array layout to offer RF performance with the same stable signal integrity offered by cabled coax solutions but with reduced size, weight and cost.
H Pin
The H-Pin provides the mechanical and electrical benefits of a spring probe pin with the cost savings and manufacturing process control of a fully automated stamping and assembly manufacturing process.