NEWS Nov 30 2020 New Volta 180 supports Wafer Level Packages and Known Good Dies test businesses The new Volta 180 Series is an advanced WLCSP test solution that expands Volta product line to include the compact 180um pitch, allowing for a higher number of chips to be tested on each wafer. It allows for a fast and reliable testing of wafers to ensure that they meet specifications and perform as they should, which translates into higher quality end products.
Latest Tweet Read on Electronics Weekly about our CEX series: #CEXseries #chipequalizers https://t.co/ZMFybQVL7Ohttps://t.co/bgk4JbCSH9
Nov 13 2019 Smiths Interconnect acquires Reflex... Reflex complements Smiths Interconnect’s product offering with the addition of a core fibre optic...
Sep 06 2019 HBB High Power Connectors now... The newly re-launched HBB series of single pole high power 300A and 500A circular connectors...
Jul 18 2019 M23 Connectors Qualified to Perform... Smiths Interconnect’s waterproof M23 connectors for demanding industrial applications under water.
Jul 18 2019 Helping Ensure Astronaut Safety Smiths Interconnect's high-speed D-sub connectors and harnesses perform well during NASA’s...
Jul 09 2019 New blind mate active optical... Reflex Photonics is proud to launch new LightCONEX® active optical blind mate interconnects...
Jul 09 2019 New blind mate active optical... Expanding on the successful LightCONEX style A compatible with VITA 66.4 aperture, Reflex...