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Thermal Management Lid Capabilities
Thermal Management Lid solutions are high value variations, including air-chilled or liquid cooled technology, capable of dissipating up to 650 Watts.
Galileo Test Socket
Innovative, low-profile test socket that provides outstanding electrical and mechanical performance for IC test customers who need a cost effective, rapid delivery solution.
Kelvin Probes Solution
Unique chisel tip provides reliable, stable contact resistance for critical applications such as loT, automotive where test performance cannot be sacrificed.
Array High Speed Test - DaVinci Micro Test Socket
Fully shielded signal path negates the effects of cross-talk during test, allowing an immediate yield enhancement.
Array High Speed Test - DaVinci 112
DaVinci 112 increases production yields and throughput, eliminating false faults and complete functional failures.
Q-Series H-Pin® Socket
Available for mid to large package sizes with a fully molded socket body and lid designed to meet the rigors of a wide variety of accelerated life testing applications.
R-Series H-Pin® Socket
Open-top reliability socket used for accelerated life testing. With versions of the compression mount open-top design available as a drop-in replacement for other legacy products on the market.
QN-Series
These sockets offer a modular design in a small outline with very low inductance. Open Top QFN socket allows for more convenient package loading and unloading in most of the same lead count options as the lidded version.
Kepler Test Socket
Contact technology combines the scrub motion of a cantilever contact with the versatility and modularity of a spring probe.
H-Pin®
A stamped spring probe with the mechanical, electrical, and thermal performance of a spring probe, and the ease of use and high volume manufacturability of a stamped contact.
ESJ Series H-Pin Socket
High-performance burn-in socket, with dual latch clamshell lid to provide co-planar pressure on the DUT when the lid is actuated.
M-Series H-Pin® Socket
The small outline footprint provides design flexibility and allows for high socket density on the burn-in board.