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Accelerated life testing solution
Smiths Interconnect has taken a leadership role in designing and developing socket solutions for the newest QFN packages such as MLF, BCC, and LPCC. These sockets offer a modular design in a small outline with very low inductance. The new Open Top QFN socket allows for more convenient package loading and unloading in most of the same lead count options as the lidded version.

Features & Benefits

  • Available in 0.40 mm, 0.50 mm, 0.65 mm,  0.80 mm, and 1.00 mm pitchesâ–  Custom pitches down to 0.30 mm
  • Lidded and Open Top Sockets for ≤10 mm packages
  • Lidded Sockets for 10 mm to 16 mm packages
  • Center ground pin standard for all sockets
  • Optional copper heat slug available for high wattage devices
  • Sockets for over 80 different JEDEC standard footprints



  • Contact: Single Beam / Stationary
  • Mounting: Thru hole
  • Insertion: ZIF
  • Contact Force: Typically 15 ±4gf
  • Operating Temperature: -45ºC to +150ºC
  • Load Cycles: 10,000 (burn-in); 50,000 (programming)


  • Contact Resistance: <50 mΩ
  • Inductance: <6 nH
  • Capacitance: <2.59 pF
  • Current Rating: 1.0 amp
  • Volume Resistivity: 1x10^15 Ω -cm
  • Insulation Resistance: 650 V / mil

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