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Planar X Filter Series

Board level Ceramic Based Thick Film RF Filters

Planar X Series is part of an overarching initiative by Smiths Interconnect that entails the creation of best-in-class planar RF filter solutions designed and tested to support various application markets.

Features & Benefits

Planar X Series compliments Smiths Interconnect’s broad portfolio of RF/Microwave components with bandpass, bandstop, lowpass and highpass configurations up to 18 GHz (Ku-Band) offering premium performance in a small package. The frequency of operation can be further extended with added material and process capabilities.

Planar X Series leverages Smiths Interconnect’s existing thick film process technology on various dielectric substrates which are designed for use in harsh high-reliability environments. The small footprint, light weight and surface mountable configuration allow for high volume pick and place applications and are ideal for SATCOM, Radar and Broadcasting industries. In addition, Smiths Interconnect offers value added high-reliability test options providing assurance in mission critical defense and space applications.

Regardless of the application, our internal processes and procedures help ensure that all filters are fully compliant to customers’ specifications.

  • Small Footprint – Reduced PCB Footprint
  • Light Weight – Reducing overall system mass in critical space applications
  • Excellent Rejection Characteristics – Providing best in class RF performance
  • Surface Mountable – Ideal solutions for Pick and Place Applications
  • Robust Materials – Suitable for Harsh Environment
  • Frequency Offerings up to 18 GHz – Suitable for a wide array of applications

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