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We provide solutions across a wide range or markets.
Fibre Channel D-Sub connectors offer high Data rate 6.25 Gbps, high shock and data resistance and high density quadrax. The main function associated with high impedance D-Sub connectors is to ground the outer shield of a quadrax contact directly to the shell of the connector.
HYPER Series offers the original superior performing hyperboloid contact technology designed for use in all applications and in harsh and demanding environments where high reliability and safety are critical. The inherent electrical and mechanical characteristics of the Hypertac® HYPERboloid conTACt ensures unrivalled performance in terms of reliability, number of mating cycles, low contact force and minimal contact resistance. The shape of the contact sleeve is formed by hyperbolically arranged contact wires, which align themselves elastically as contact lines around the pin, providing a number of linear contact paths.
MDCX, multipin coax connectors, offer low VSWR of 1.25:1 (typ) up to 10 GHz (max mated pair), maximum overall diameter of 0.125" fitted into low-profile micro-D housing, with constant 50 Ohm airline impedance. MDCX coaxial contacts are compact in size allowing multiple high density connections in a Micro-D style shell for applications where space and weight savings are important. No cumbersome spring mounts are required. These connectors are also available with locking post mechanisms or blindmate hardware attachment.
Spring loaded High Frequency Micro-D Coax Connectors (MDHC) offer low VSWR up to 40 GHz (typ). These connectors have a constant 50 ohm airline impedance interface and are 30% smaller than our SCX coaxial connectors.
Micro quadrax/twinax connectors are available in threaded, quick disconnect, SMA and Micro-D size packages, 25% smaller in diameter than SMA coaxial connectors, controlled impedance with tightly spaced PCB footprint.
Low and high power RF resistors and terminations including surface mount chips, tab & cover chips, flange mounted and rod types. These resistors are available with Alumina, ALN, BeO and CVD substrate materials. The CTX Series of high frequency wire bondable chip terminations, HR-CTX Series of high frequency high reliability wire bondable chip terminations and CTX SMT Series of high frequency surface mount chip terminations are optimized to combine high frequency, and power in a small package
High impedance D-Sub connectors are designed to ground the outer shield of a twinax or quadrax contact directly to the shell of the connector. A multi-finger ground spring fixed around the shell provides a multi-point contact engagement that affords superior EMI shielding. The end result is an extremely low contact resistance when measured from the contact outer body to the connector flange, ensuring minimal RF noise and high durability of over 500 mating cycles.
Rugged 2mm backplane connector system is a compliant PICMG Compact PCI standard solution that provides engineers with an advanced interconnect system to address the requirements of mission-critical applications within commercial aerospace, space and defense market segments.
ARINC 628 connectors feature hyperboloid contact technology and ensure immunity to shock and vibration, minimal contact resistance, high reliability and cost effectiveness.
Rugged DIN style contacts and connectors that are capable of supporting wide bandwidth applications. All fiber optic contacts are offered fully terminated and tested to ensure integrity for rugged environments. Smiths Interconnect also offers a complete line of fiber optic connectors to terminate to the other end of the cables. These include ruggedized single channel (RSC), FC, ST, LC Duplex/Simplex, MTP, MT-RJ and Ruggedized SC connectors. Please consult factory for cabling options.
Smiths Interconnect is a leading provider of technically differentiated electronic components, subsystems, microwave and radio frequency products that connect, protect and control critical applications in the commercial aviation, defense, space, medical, rail, semiconductor test, wireless telecommunications, and industrial markets.