ESJ Series H-Pin Socket
High-performance burn-in socket, with dual latch clamshell lid to provide co-planar pressure on the DUT when the lid is actuated.
Kepler Test Socket
Contact technology combines the scrub motion of a cantilever contact with the versatility and modularity of a spring probe.
K Series H-Pin® Socket
This socket also uses the H-Pin contact technology providing wide RF performance capabilities and exceptional DC characteristics. The K-Series socket checks all the boxes: high frequency, high current, high temperature, low inductance, and Low loss.
M-Series H-Pin® Socket
The small outline footprint provides design flexibility and allows for high socket density on the burn-in board.
Peripheral Strip Test
Highly reliable multi site strip test socket . Customized design to suite any strip test handler.
Q-Series H-Pin® Socket
Available for mid to large package sizes with a fully molded socket body and lid designed to meet the rigors of a wide variety of accelerated life testing applications.
Peripheral Tri-Temp Test
Celsius test sockets feature a wiping contact technology perfect for QFN testing.
These sockets offer a modular design in a small outline with very low inductance. Open Top QFN socket allows for more convenient package loading and unloading in most of the same lead count options as the lidded version.
Silmat® Elastomeric Test Socket
Extremely short signal path and capable to handle >40GHz. Customized test socket design for lab, engineering, SLT and ATE tests.
R-Series H-Pin® Socket
Open-top reliability socket used for accelerated life testing. With versions of the compression mount open-top design available as a drop-in replacement for other legacy products on the market.
Standard Array & Peripheral Test
Customized test sockets for any IC packages. Suitable for lab, Engineering, SLT & ATE test applications.
Thermal Management Lid Capabilities
Thermal Management Lid solutions are high value variations, including air-chilled or liquid cooled technology, capable of dissipating up to 650 Watts.